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Coollab Liquid Ultra thermal compound

Coollaboratory Liquid Ultra: New high-end liquid metal thermal compound

According to information available to PC Games Hardware, Coollaboratory is going to introduce Liquid Ultra soon. One of the advantages in comparison to the Liquid Pro is the easy removal.
Coolaboratory Liquid Ultra: New High-End Thermal Compound under way (4)
Coolaboratory Liquid Ultra: New High-End Thermal Compound under way (4) [Source: view picture gallery]
Up to today the Liquid Pro of Coolaboratory is in matter of heat transfer capabilities one of the best thermal compounds. But it has one big disadvantage: Its consistency: First of all it is difficult to apply (the Liquid Pro has a low viscosity like mercury) and secondly it is difficult to remove once it is on the processor. Coollaboratory has a metal pad that avoids this, but has another disadvantage instead. It can be used only once and needs a ‘burn-in': So it has to be brought to a very high temperature once so it gets liquid.

The new compound Liquid Ultra apparently doesn't have those disadvantages. Although it consists of liquid metal like the Pro version it is less fluid. Thus it is easier to compensate clearances. Coollaboratory's Liquid Ultra is supposed to be easier to handle and easier to remove since it doesn't harden between the chip and the heatsink. Depending on the usage the Liquid Ultra is supposed to deliver the same performance as the Liquid Pro or the metal pad - possibly it is even doing a little better. An official clearance for aluminum heatsinks and cooler has not been given to the Liquid Ultra, but nevertheless it is not as aggressive to this material as the Liquid Pro.

According to our sources the Coollaboratory Liquid Ultra will hit the markets in mid-January for 8.90 Euros.

Picture gallery  (enlarge to view source)

Author: Thilo Bayer (Jan 12, 2010)


Comments (4)

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dried Re: Coollaboratory Liquid Ultra: New high-end liquid metal thermal compound
13.01.2010 11:33
Quote: (Originally Posted by Unregistered)
You're wrong. Even if you ground the surfaces down to the kind of tolerances the best prosthetics use (joing replacements), you would still need to use a lubricant. In fact, these kinds of devices still have so much friction, that without sinovial fluid they rapidly break down (and even with still only last 5-10 years on average). That's of course due to microscopic imperfection in the mating surface. With regards to heatsinks, the point is that even with that kind of fine processing - which is impractical by hundreds of orders of magnitude - you'd still benefit from some sort of thermal interface.

You are right, no lapping would ever be perfect, but im not saying you should do so and fix your waterblock / heatsink without one.
Most of the time, the IHS is not flat, and you have a few options to "fix the problem".

1. Lapping and applying a thermal compound
2. Like ruyven_macaran said, remove the IHS (but i guess its not really recommended )
3. Just apply thermal compound

And as far as i am concerned, thermal compound really matters when we are talking about the third option (or the second, i dont know how uneven a processor die could be). The whole idea of lapping is to make a direct contact between the IHS and the heatsink, thus making thermal compound less important (you sill HAVE to apply it, but does it make so much difference between brands?).

But i agree with both of you. You cant get rid of these tiny cracks.
ruyven_macaran Re: Coollaboratory Liquid Ultra: New high-end liquid metal thermal compound
Super Moderator
13.01.2010 02:21
Actually, PCGH-Extreme printed tested the effects of lapping or even removing the IHS and they had to apply heavy overvolting to get a reasonable difference at all. Using a E1200 (I know: just a Celeron, but still a 65nm Dual-Core) they got only 1°C of difference at stock Voltage (and a nice 92% overclocking) for the lapped IHS and 0°C for lapped+polished (0,5 for removed - so basically no difference at all within measurement uncertainity). Only when raising Vcore to a whooping 1,6V (and getting close to 100% overclock), they managed to get 8°C less after lapping, 14°C after removing the IHS. Liquid Pro on the other hand usually has an 2 to 5°C advantage to other upper-class thermal compounds without using extreme voltages.
In my opinion lapping only makes a difference, if the IHS is warped - if it is already flat, you can hardly improve the smoothness, only a good thermal compound will help with these tiny cracks.
dried Re: Coollaboratory Liquid Ultra: New high-end liqu...
12.01.2010 20:10
Correct if im wrong, but i still think the best way to make a good thermal contact would be by lapping both the processor and heatsink.

The thermal compound could help, but i would not expect a drop in temps of more than 2 degrees.

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